Finite element sensitivity and reliability analysis with application in thermal management of LED packages - Université Toulouse III - Paul Sabatier - Toulouse INP Accéder directement au contenu
Communication Dans Un Congrès Année : 2021

Finite element sensitivity and reliability analysis with application in thermal management of LED packages

Résumé

In solid-state lighting, the performance of high-power LEDs is depending highly on the junction temperature. Good thermal management is essential for LED packaging. Therefore, a high junction temperature operation leads to failure of light intensity and service life. In this paper, we develop a three-dimensional thermal analysis of a 3.5W multi-chip COB (chip-on-board) LED package using ANSYS ® software. The developed finite element model was validated by comparing our results with the results found in the literature. Then, we carry out a sensitivity analysis on the different material layers in order to bring out the parameters most influencing the temperature field via the Sobol method. Finally, a reliability analysis is conducted to calculate the failure probability and indices failure using the Monte Carlo and FORM/SORM methods.
Fichier non déposé

Dates et versions

hal-03540065 , version 1 (22-01-2022)

Identifiants

Citer

Houda El Nouino, Omar Bendaou, Othmane Bendaou, Laurent Canale, Adel Asselman. Finite element sensitivity and reliability analysis with application in thermal management of LED packages. 2021 IEEE Industry Applications Society Annual Meeting (IAS), Oct 2021, Vancouver, Canada. pp.1-6, ⟨10.1109/IAS48185.2021.9677138⟩. ⟨hal-03540065⟩
24 Consultations
0 Téléchargements

Altmetric

Partager

Gmail Facebook X LinkedIn More