Finite element sensitivity and reliability analysis with application in thermal management of LED packages
Résumé
In solid-state lighting, the performance of high-power LEDs is depending highly on the junction temperature. Good thermal management is essential for LED packaging. Therefore, a high junction temperature operation leads to failure of light intensity and service life. In this paper, we develop a three-dimensional thermal analysis of a 3.5W multi-chip COB (chip-on-board) LED package using ANSYS ® software. The developed finite element model was validated by comparing our results with the results found in the literature. Then, we carry out a sensitivity analysis on the different material layers in order to bring out the parameters most influencing the temperature field via the Sobol method. Finally, a reliability analysis is conducted to calculate the failure probability and indices failure using the Monte Carlo and FORM/SORM methods.