Low-pressure plasma processing Transmission electron microscopy TEM CH4 A Thin films Residual stress AZO thin films Carbon Nanotube A-CNx Optical properties Biocapteurs Magnetron sputtering Semiconductors Ambipolar material Mott insulator Capacitance X-ray photoelectron spectroscopy XPS Calcined clay A1 Characterization Band gap AlN Carbon Argon InP chlorine etching inductive coupled plasma ICP modeling plasma sheath simulation Bipolar resistive switching BRS Alzheimer's disease Sol-gel Vanadium Sesquioxide A Chalcogenides Atomic layer etching A3 Physical vapor deposition processes Resistive switching Atomic force microscopy A Multilayers Optical interferometry Plasma etching Spectroscopic ellipsometry Avalanche breakdown Anatase BOMBARDMENT B2 Semiconducting indium compounds Mass spectrometry X-ray diffraction Buffer Couple Adsorption CIGSe Transfert d'énergie AuCu alloy Aluminium nitride Integrated optics Plasmas froids B Chemical synthesis Selenization TiO2 B2 Semiconducting alloys B1 Inorganic compounds PECVD V2O3 Biomembranes Nanocomposite Alloying Thin film Structure Non-volatile memory Amorphous Nanotubes Functionalization Copper Rutile Kirkendall effect Mott insulators Amyloid precursor Films Optical waveguides Thin films SF 6 CHLORINE PLASMAS Ablation laser Colloidal solution Chalcogenide Biomasse Oxides C Photoelectron spectroscopy Titanium dioxide Annealing Scanning electron microscopy B3 Solar cells Sputtering B2 Quaternary Physical vapor deposition CNTs’ collapse Etching Biofilms microbiens Aryl-diazonium salts Applications industrielles Bixbyite 3 nm in size Band alignment CaTiO3Pr^3^+ NEXAFS