Communication Dans Un Congrès Année : 2024

Integration of 3D Rogowski sensor within power module

Résumé

This study deals with the integration of Rogowski sensor into power module using 3D printing for the coil former and the custom-designed casing. The sensor design is done considering the fundamental constraints of Rogowski sensors and specific integration requirements. The sensor fabrication process is described, and performance tests are presented. Finally, measurements taken on a double-pulse test bench are discussed, highlighting the designed sensor ability to measure currents into medium/high power modules on wide frequency bandwidth.

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Dates et versions

hal-04936045 , version 1 (10-02-2025)

Identifiants

Citer

Guillaume Viné, Paul-Etienne Vidal, Philippe Lasserre, Julie Tarrieu, Stéphane Baffreau. Integration of 3D Rogowski sensor within power module. 2024 IEEE Design Methodologies Conference (DMC), Nov 2024, Grenobe, France. pp.1-6, ⟨10.1109/DMC62632.2024.10812159⟩. ⟨hal-04936045⟩
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